제목 Mechanical Abrasion by Bi-layered Pad Micro-Asperity in Chemical Mechanical Polishing 저자 Hyun Jun Ryu, Dong Geun Kim, Sukkyung Kang, Ji-hun Jeong, Sanha Kim 키워드 Abrasion, Polishing, Material Removal Abstract Pad asperities in chemical-mechanical polishing (CMP) provide necessary forces for mechanical abrasion. This article investigates the abrasive behaviour of polishing pads at the asperity contact scale.
A contact mechanics model predicts that compliant and soft asperities or rigid and hard...
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CIRT
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재료제거
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연마패드
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연마
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석사
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반도체
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박사
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대학원생
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논문
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기계적화학적연마
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기계공학과
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공정
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SCIE
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KAIST
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Elsevier
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CMP
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